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  • Product Details
  •  HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.


    We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .


     We offer three bonds soft, medium, and hard.


    Grinding plate fitted on HTC grinder machines.


    Grit:16#, 30/40#, 60/80#, 120/150#

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