HTC Resin Floor Polishing Pads

Grit: 50#,100#, 200#,500#,1000#,2000#,3000# Use wet or dry Suit HTC grinding machine.

Husqvarna Floor Grinding Diamond Segment

Husqvarna Floor Grinding Diamond SegmentS are used on Redi-Lock system plate. with a bar on the back 1.Two Bars 2. Dry grinding. For stone and concrete,terrazzo etc. 3.Grit:16-120# 4.Bond:soft bond,medium bond, hard bond

HTC Floor Grinding Diamond Segments(White)

HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.   We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .    We offer three bonds soft, medium, and hard.   Grinding plate fit on HTC machine   Grit:16#, 30/40#, 60/80#, 120/150#   Segment size:40x10x10mm or 40x12x12mm 

PCD Grinding Segments For HTC

Specification: 1.Grit:16#,18/20#,30/40#,60/80#,120/150# 2.Soft,Medium,Hard Bond 3.HTC floor system plate 4.Renovate your floor more clear

Diamond Grinding Plug For Terrazzo

Specification: 1.Diameter: 50mm 2.Grit:16#,18/20#,30/40#,60/80#,120/150# 3.Soft,Medium,Hard Bond 4.For floor epoxy 5.Renovate your floor more clear Quality guarante : 1.ISO9001-2000 Certificate                                                                      2.Above 10 years diamond tools exporting experience                                   3.Good service comment & product feedback from customers Application 50mm in diameter, fit all plug type terrco grinding machines, use with surface terrazzo plug dive plate.

T Bone Pad Floor Polishing Pads (DMY23)

 These resin bond discs can withstand the friction which dry applications create. One of the main benefits of these pads are they are flexible. This allows them to follow the floor more than a more rigid pad. They are an excellent choice for customers who need high performance cost-efficient dry polishing disc to finish the job using a dry application tool. Size:3''   Grit:50-3000#