Metal Grinding Diamonds with Two Pins

 Specification: 1.Grit:16#-150# 2.Soft,Medium,Hard Bond 3.Werkmaster floor system plate 4.Renovate your floor more clear

Metal Diamonds with 4 segs For Terrco Quick Change

 The 4 Seg Disc grinding system is an innovative solution for your grinding needs. Suit Terrco Quick Change Plate. Size:3'' No.: 4 segments Bond:Very soft, soft, medium, hard, very hard bond. Grit:16-400#

Super Thin Rubber Backer Pad BP04

 The backer pads are hook Velcro backed, they accept polishing pads with Velcro loop backed. We have rigid backer pads made from Bakelite, Flexible backer pads made from rubber, extremely flexible backer pads made from supper quality rubber . All the backer pads are ideally suited for all kinds of machines with Arbor 5/8”-11 threaded or M14 threaded. Size:4" Arbor:M14 thread, 5/8"-11 thread

Round Segment Grinding Diamond for Lavina Grinder

 Specification: 1.Grit:16#-150# 2.Soft,Medium,Hard Bond 3.Lavina floor system plate 4.Renovate your floor more clear

PCD cutters for heavy coating removal

  These diamond cutters sets are designed for BW floor grinders. They are suitable and available for grinding soft, medium and hard concrete.  

Grinding Diamond Segments for HTC Grinders

 HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.   We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .    We offer three bonds soft, medium, and hard.   Grinding plate fitted on HTC grinder machines.   Grit:16#, 30/40#, 60/80#, 120/150#