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  • Product Details
  •  This kind of  8 segments metal bond grinding diamond is designed for quick removal of thinset, glue & mastics an ideal tool substrate preparation.

    Use wet or dry.

    Size:3"/83mm

    Segment Height:8mm

    Attachment system:1 Pin and 3 Screw holes

    Fitted to machines:some types floor grinders ,like STI, Premaster floor machines.

    Bond:hard,soft,medium

    Grit:16/20#,30/40#,60/80#,120/150#, other grits are available.

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