This kind of 8 segments metal bond grinding diamond is designed for quick removal of thinset, glue & mastics an ideal tool substrate preparation.
Use wet or dry.
Size:3"/83mm
Segment Height:8mm
Attachment system:1 Pin and 3 Screw holes
Fitted to machines:some types floor grinders ,like STI, Premaster floor machines.
Bond:hard,soft,medium
Grit:16/20#,30/40#,60/80#,120/150#, other grits are available.