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- Copper and Resin Bond Polishing Pads_Sunflower Pad SDM_01
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Name:Copper and Resin Bond Polishing Pads_Sunflower Pad SDM_01
1 Classification:Diamond Polishing Tools
2 Classification:Wet Polishing Pads
Clicks:4423
Inquiry number:12
Recommended:No
- Product Details
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The Sunflower Pads are a combination of copper and resin bond designed for polishing straight edges.Applied on hand angle grinders to achieve a higher gloss.The copper bond is a soft metal that will remove scratches better than a metal bond,allowing the resin bond to polish to the highest luster.
4'' diameter available currently.
Grit No: 50#,100#,200#,400#,800#,1500#,3000#
Delivery time:7-12days depands on the order quantity
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