HTC Resin Floor Polishing Pads

Grit: 50#,100#, 200#,500#,1000#,2000#,3000# Use wet or dry Suit HTC grinding machine.

PCD Grinding Diamonds For HTC grinders with a Protection Segment

 The ultimate tool for stripping and coarse-grinding equipped with a protection segment.   Specification: 1.Grit:16#,18/20#,30/40#,60/80#,120/150# 2.Soft,Medium,Hard Bond 3.with Right and Left direction(clockwise and counter-clockwise, ) 4.HTC floor system plate    

PCD cutters for heavy coating removal

  These diamond cutters sets are designed for BW floor grinders. They are suitable and available for grinding soft, medium and hard concrete.  

Grinding Diamond Segments for HTC Grinders

 HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.   We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .    We offer three bonds soft, medium, and hard.   Grinding plate fitted on HTC grinder machines.   Grit:16#, 30/40#, 60/80#, 120/150#

Round Segment Grinding Diamond for Lavina Grinder

 Specification: 1.Grit:16#-150# 2.Soft,Medium,Hard Bond 3.Lavina floor system plate 4.Renovate your floor more clear

Super Thin Rubber Backer Pad BP04

 The backer pads are hook Velcro backed, they accept polishing pads with Velcro loop backed. We have rigid backer pads made from Bakelite, Flexible backer pads made from rubber, extremely flexible backer pads made from supper quality rubber . All the backer pads are ideally suited for all kinds of machines with Arbor 5/8”-11 threaded or M14 threaded. Size:4" Arbor:M14 thread, 5/8"-11 thread