Diamond saw blade for ceramic tile

Diamond saw blade for ceramic tile   Diamond saw blades for ceramic tile are mainly used for cutting all kinds of ceramic tiles. The advantages are fast cutting speed. Smooth cutting and long lifespan.     Music slot cutting blades forceramic Unit:mm Item No Diameter Segment Dimension Teeth Inner Hole Normal core Inch mm Thickness Height Number CN105 4" 105 2.0 8/10/12 8 16/20 CN115 4.5" 115 2.2 8/10/12 9 16/20 CN125 5" 125 2.2 8/10/12 10 16/20 CN150 6" 150 2.2 8/10/12 11 20/22.23 CN180 7" 180 2.4 8/10/12 12 20/22.23 CN200 8" 200 2.4 8/10/12 13 20/22.23 CN230 9" 230 2.6 8/10/12 16 20/22.23 CN250 10" 250 2.6 8/10/12 18 20/22.23 CN300 12" 300 3 10/12 20/21 20/22.23  

Laser Welding Blade For Asphalt

Laser welding is a high technology for diamond blade welded in recent years. Feature: Fast cutting and long life, strengthening the security in the process of using blades, especially suitable for handed Motors use. Application: Asphalt, Green Concrete, Abrasive materials. Grade of Blade: Super Grade, Superior Grade, Standard Grade, Normal Grade. Attention: Multi blade size: 32" to 72"; Silent blade size: 12" to 48"; Arbor size, and other specifications are available on customer's request. Part NO.   Diameter   segment thickness   Hole diameter   segment height   metric   inch   LHLAC4   105   4   2.0   22.23   7/8   LHLAC4.5   115   4.5   2.2   22.23   7/8   LHLAC5   125   5   2.2   22.23   7/8   LHLAC6   150   6   2.4   22.23   7/8   LHLAC7   180   7   2.4   22.23   7/8   LHLAC8   200   8   2.4   22.23   7/8   LHLAC9   230   9   2.4   22.23   7/8   LHLAC10   250   10   2.6   22.23   7/8   LHLAC12   300   12   3.2   25.4   7/8   LHLAC14   350   14   3.2   25.4   7/8   LHLAC16   400   16   3.4   25.4   8/10   LHLAC18   450   18   3.6   50.0   8/10   LHLAC20   500   20   3.8   50.0   8/10   LHLAC22   550   22   4.2   50.0   8/10   LHLAC24   600   24   4.4   50.0   8/10

Arrow Segments Grinding Shoes DMY_63

Designed for floor polishing machines to aggressive removal and fast concrete floor grinding. They suit on magnetic plate or other plates.grinding plate fit on Huaqvarna machine or other concrete floor grinders. Grit: 16#, 18/20#, 30/40#, 60/80#, 120/150# Segment Height: 8/10mm Delivery Time: 7-12 days   

Grinding Diamond Segments for HTC Grinders

 HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.   We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .    We offer three bonds soft, medium, and hard.   Grinding plate fitted on HTC grinder machines.   Grit:16#, 30/40#, 60/80#, 120/150#

PCD cutters for heavy coating removal

  These diamond cutters sets are designed for BW floor grinders. They are suitable and available for grinding soft, medium and hard concrete.  

Resin Polishing Pads Applied on HTC Grinder

1.HTC type 2.Resin bond 3.Availabe grit: 50-100-200-400-800-1500-3000 4.Aggressive grinding and polising for stone floors,especially work well on concrete floor 5.Both wet and dry polishing. But better polishing gloss and stone surface with water 6.Quantity discount is available