HTC Resin Floor Polishing Pads

Grit: 50#,100#, 200#,500#,1000#,2000#,3000# Use wet or dry Suit HTC grinding machine.

Laser granite blades

Diamond circular saw blades Diamond circular saw blades are widely used for cutting and grinding rough blocks and slabs. Company mainly produces diamond circular saw blades for wide usage and professional cutting, such as for cutting granite, marble, sandstone, etc. We ensure our products in high quality and outstanding performance with the following characteristics: Easy and smooth cutting. Long lifespan and stable performance. Good cutting result and high efficiency. The following products are available: Hot-pressing sintered diamond saw blades, laser welded diamond saw blades, braze-welded diamond saw blades; diamond saw blades with silent steel core, etc.  

Laser Welding Blade For Asphalt

Laser welding is a high technology for diamond blade welded in recent years. Feature: Fast cutting and long life, strengthening the security in the process of using blades, especially suitable for handed Motors use. Application: Asphalt, Green Concrete, Abrasive materials. Grade of Blade: Super Grade, Superior Grade, Standard Grade, Normal Grade. Attention: Multi blade size: 32" to 72"; Silent blade size: 12" to 48"; Arbor size, and other specifications are available on customer's request. Part NO.   Diameter   segment thickness   Hole diameter   segment height   metric   inch   LHLAC4   105   4   2.0   22.23   7/8   LHLAC4.5   115   4.5   2.2   22.23   7/8   LHLAC5   125   5   2.2   22.23   7/8   LHLAC6   150   6   2.4   22.23   7/8   LHLAC7   180   7   2.4   22.23   7/8   LHLAC8   200   8   2.4   22.23   7/8   LHLAC9   230   9   2.4   22.23   7/8   LHLAC10   250   10   2.6   22.23   7/8   LHLAC12   300   12   3.2   25.4   7/8   LHLAC14   350   14   3.2   25.4   7/8   LHLAC16   400   16   3.4   25.4   8/10   LHLAC18   450   18   3.6   50.0   8/10   LHLAC20   500   20   3.8   50.0   8/10   LHLAC22   550   22   4.2   50.0   8/10   LHLAC24   600   24   4.4   50.0   8/10

Grinding Diamond Segments for HTC Grinders

 HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.   We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .    We offer three bonds soft, medium, and hard.   Grinding plate fitted on HTC grinder machines.   Grit:16#, 30/40#, 60/80#, 120/150#

Hybrid Type Resin Floor Polishing Pads (DMY36A)

The Pregnant Diamond Metal-Chip Polishing Pads, flexible or rigid, one of our patent pending products, a serial of high capability pads, Grit 50#--3000# Size:3'',4'' Can be used by wet or by dry. They can be applied to excellent fabrication of marble, concrete and granite. They are perfect at polishing concrete floor by dry. Everyone who has used them likes the combination of aggressive and long lasting performance. (See the Product Number Below) HAL Hardest Epoxy Dry Use Floor Pads. This is a serial of High gloss dry pads. The HAL dry pads with high diamond concentration, hardest epoxy with aluminum oxide filler are perfect for the floor of concrete and terrazzo.

PCD cutters for heavy coating removal

  These diamond cutters sets are designed for BW floor grinders. They are suitable and available for grinding soft, medium and hard concrete.