Grinding Diamond Segments for HTC Grinders

 HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.   We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .    We offer three bonds soft, medium, and hard.   Grinding plate fitted on HTC grinder machines.   Grit:16#, 30/40#, 60/80#, 120/150#

PCD Grinding Diamonds For HTC grinders with a Protection Segment

 The ultimate tool for stripping and coarse-grinding equipped with a protection segment.   Specification: 1.Grit:16#,18/20#,30/40#,60/80#,120/150# 2.Soft,Medium,Hard Bond 3.with Right and Left direction(clockwise and counter-clockwise, ) 4.HTC floor system plate    

Resin Polishing Pads Applied on HTC Grinder

Resin Polishing Pads Applied on HTC Grinder 1.HTC type 2.Resin bond 3.Availabe grit: 50-100-200-400-800-1500-3000 4.Aggressive grinding and polising for stone floors,especially work well on concrete floor 5.Both wet and dry polishing. But better polishing gloss and stone surface with water 6.Quantity discount is available

HTC Resin Floor Polishing Pads

Grit: 50#,100#, 200#,500#,1000#,2000#,3000# Use wet or dry Suit HTC grinding machine.

80mm Grinding Wheel With GAS 1/2 Adaptor

 Segment Height:20,30,40mm Size:3'',4'',5'' Thread: GAS 1/2'' Used on hand power tools  

Diamond Cutters for BW Floor Grinders

 These diamond cutters sets are designed for BW floor grinders. They are suitable and available for grinding soft, medium and hard concrete. Grits: 16#, 30#, 80#, 140#, 180#. Bond Agent: Extra Coarse, Coarse, Medium, Medium/Fine and Fine.