Round Segment Grinding Diamond for Lavina Grinder

 Specification: 1.Grit:16#-150# 2.Soft,Medium,Hard Bond 3.Lavina floor system plate 4.Renovate your floor more clear

PCD cutters for heavy coating removal

  These diamond cutters sets are designed for BW floor grinders. They are suitable and available for grinding soft, medium and hard concrete.  

Grinding Diamond Segments for HTC Grinders

 HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing.   We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments .    We offer three bonds soft, medium, and hard.   Grinding plate fitted on HTC grinder machines.   Grit:16#, 30/40#, 60/80#, 120/150#

PCD Grinding Diamonds For HTC grinders with a Protection Segment

 The ultimate tool for stripping and coarse-grinding equipped with a protection segment.   Specification: 1.Grit:16#,18/20#,30/40#,60/80#,120/150# 2.Soft,Medium,Hard Bond 3.with Right and Left direction(clockwise and counter-clockwise, ) 4.HTC floor system plate    

Resin Polishing Pads Applied on HTC Grinder

Resin Polishing Pads Applied on HTC Grinder 1.HTC type 2.Resin bond 3.Availabe grit: 50-100-200-400-800-1500-3000 4.Aggressive grinding and polising for stone floors,especially work well on concrete floor 5.Both wet and dry polishing. But better polishing gloss and stone surface with water 6.Quantity discount is available

HTC Resin Floor Polishing Pads

Grit: 50#,100#, 200#,500#,1000#,2000#,3000# Use wet or dry Suit HTC grinding machine.