HTC Floor Grinding Diamond Segments(White)
HTC grinding diamond segments are designed for thin mil coating removal, mastic removal, and for the first steps in polishing. We offer these diamonds in double bar and single bar segment design,of course can also be rounds or arrow segments . We offer three bonds soft, medium, and hard. Grinding plate fit on HTC machine Grit:16#, 30/40#, 60/80#, 120/150# Segment size:40x10x10mm or 40x12x12mm
6 segs metal diamond floor grinding pads DMY38
This kind of 6 segment metal bond grinding disc is designed for quick removal of thinset, glue & mastics an ideal tool substrate preparation. Use wet or dry. Attachment system:Velcro back or 3 thread holes, or with 1 pin/post Bond:hard,soft,medium Grit:16#-400#
Arrow floor grinding diamond discs
This kind of 5 arrow segments metal bond grinding disc is designed for quick removal of thinset, glue & mastics an ideal tool substrate preparation. Use wet or dry. Attachment system:velcro backed or 3 thread Bond:hard,soft,medium Grit:16#-400#
3'' Metal Resin Transitional Pad
3" Metal Resin Transitional Pad Grit: 30-400# A great choice when transitioning from traditional metals to resins. Long life!
Metal Floor Grinding Pad is the metal segment pads. With long lifetime and more aggressive removal ability. Velcro backed. Only Size: 3" Grit: 30#,50#,100#,200#,400#
250mm Diamond Floor Grinding Plate for Concrete
Size: 10 inch/250mm Segment size:40x10x10m Segment No.: 16 Grit:16-400# This kind of diamond grinding plate fits on EDCO,SPE, Husqvarna and Satellite etc Floor Concrete Grinders.