Flexible Polishing Pads_Buff (BUFF_B or BUFF_W)
Flexible Polishing Pads-Buff(BUFF_B or BUFF_W) Characteristic: good definition, above 95 °C Color: Black or White Delivery Time:7-12 days BUFF Diameter 80mm 100mm 125mm
8 Segments Metal Grinding Diamond With Pin for Concrete
This kind of 8 segments metal bond grinding diamond is designed for quick removal of thinset, glue & mastics an ideal tool substrate preparation. Use wet or dry. Size:3"/83mm Segment Height:8mm Attachment system:1 Pin and 3 Screw holes Fitted to machines:some types floor grinders ,like STI, Premaster floor machines. Bond:hard,soft,medium Grit:16/20#,30/40#,60/80#,120/150#, other grits are available.
Bush Hammer Plate with Lavina Traps for Coating Removing
Type:Bush Hammer Plate with Lavina Traps for Coating Removing Fitted to put on different sizes of bush hammer plates. APPLICATIONS: 1. To create anti-slip surfaces. 2. To remove old glue and resin coatings, in particular thick resins. 3. To use as a scarifying machine with the advantage that it is aggressive but gentle enough not to “dig” uncontrollably into the floor surface. 4. For floor preparation before laying new coatings. 5. To expose the aggregate in concrete floors to prepare for concrete polishing.
Diamond frankfurts are used for grinding and polishing marble. Matching machines:home-made imported automatic continuous polishing machine or single head grinding machine. The specifications of abrasives can be chosen according to the heads of polishing machines Delivery Time:7-12 days Name Grit DF01 50# 200# 400# 500# 800# 1500# 0#
Diamond abrasives (Resin/Magnetite Bond) are especially used for grinding and polishing, and fit for the following machines: automatic continuous polishing machine, or single head grinding machine. Delivery Time:7-12 days The specifications of abrasives can be customized according to the heads of polishing machines. Name Type Grit DA01 L140 16 24 46 60 120 220 320 400 800 1000 1200 1500 LUX01 LUX02 L170 14-240 280-800 1000-3000 LUX02 LUX01
Velcro Concrete Grinding Diamond Pads DMY_35
This kind of 8 segments metal bond grinding disc is designed for quick removal of thinset, glue & mastics an ideal tool substrate preparation. Use wet or dry. 3''x8seg; 4''x10seg Velcro back and 3xM6 thread Bond: soft,medium,hard Grit: 30#-150#